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TG130 6 Layer PCB Board ENIG Surface finish HDI Buried Blind Vias Hole

Shenzhen Betterliv Technology Co., Ltd.
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TG130 6 Layer PCB Board ENIG Surface finish HDI Buried Blind Vias Hole

Brand Name : Betterliv/OEM

Model Number : OEM

Certification : ISO9001 FCC

Place of Origin : Shenzhen,China

Payment Terms : T/T, Western Union, Credit Card

Layer : 6

Min. Line Width : 8mil

Base Material : FR4 TG130

Copper Thickness : 1OZ

Surface finish : ENIG

Board thickness : 1.6mm

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Fast Custom 6 Layers HDI Buried Blind Vias Hole PCB Quick Turn PCB Assembly For Eelectrical Products

PCB Manufacture Capability

Layers
6 Layers
Material
FR4 TG130
Copper thichness
1oz
Board thickness
1.6mm
Min. Hole Size
0.3mm
Min. Line Width
8mil
Min. Line Spacing
8mil
Surface Finish
ENIG
S/M Color
Blue
Special Process
HDI, BVH, back drill, pressfit hole, edge plating, VOP, counter sunk, half hole, gold plating, gold finger, ENIG+OSP, flex board, rigid-flex board

Our service

We are manufacturer, specializing in PCB and PCBA R&D and production.

Our products are widely applied to a variety of electronic industries such as communications,industrial control,medical electronics and automotive electronics.

• Electronic components material purchasing
• Bare PCB fabrication
• PCB Assembly Service. (SMT, DIP)
• FULL Test: AOI, X-Ray, In-Circuit Test (ICT), Functional Test (FCT)
• Conformal coating service
• Prototyping and mass production...
• PCB layout, PCBA design according to your idea


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